Towa group (overseas) | world-leading provider of semiconductor packaging solutions. We will continue to work in the next generation as a field for creating a new future by operating a quarter. Developed by utilizing technologies cultivated through the manufacture of ultra-precision molds, end mills and drills from towa boast high precision, superior abrasion resistance, and a long life-span.

We offer equipment using our proven transfer molding method, and high quality / flow free compression molding method. At towa, we market molding equipment (resin sealing equipment) that utilizes the transfer method. With this method, a flowable resin for protecting the semiconductor chips is applied to the area. Forty years have passed since the development of our proprietary multi-plunger system, which has become the de facto standard, many unique technologies of towa have become trends in the field.